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| BSM 25 GD 120 DN2 IGBT Power Module * Power module * 3-phase full-bridge * Including fast free-wheel diodes * Package with insulated metal base plate Type BSM 25 GD 120 DN2 BSM 25 GD120DN2E3224 Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage RGE = 20 k Gate-emitter voltage DC collector current TC = 25 C TC = 80 C Pulsed collector current, tp = 1 ms TC = 25 C TC = 80 C Power dissipation per IGBT TC = 25 C Chip temperature Storage temperature Thermal resistance, chip case Diode thermal resistance, chip case Insulation test voltage, t = 1min. Creepage distance Clearance DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Tj Tstg RthJC RthJCD Vis Ptot 200 + 150 -40 ... + 125 0.6 1 2500 16 11 F 40 / 125 / 56 sec Vac mm K/W C ICpuls 70 50 W VGE IC 35 25 Symbol VCE VCGR 1200 20 A Values 1200 Unit V VCE IC Package ECONOPACK 2 ECONOPACK 2K Ordering Code C67076-A2505-A67 C67070-A2505-A67 1200V 35A 1200V 35A 1 Oct-20-1997 BSM 25 GD 120 DN2 Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Symbol min. Static Characteristics Gate threshold voltage VGE = VCE, IC = 1 mA Collector-emitter saturation voltage VGE = 15 V, IC = 25 A, Tj = 25 C VGE = 15 V, IC = 25 A, Tj = 125 C Zero gate voltage collector current VCE = 1200 V, VGE = 0 V, Tj = 25 C VCE = 1200 V, VGE = 0 V, Tj = 125 C Gate-emitter leakage current VGE = 20 V, VCE = 0 V AC Characteristics Transconductance VCE = 20 V, IC = 25 A Input capacitance VCE = 25 V, VGE = 0 V, f = 1 MHz Output capacitance VCE = 25 V, VGE = 0 V, f = 1 MHz Reverse transfer capacitance VCE = 25 V, VGE = 0 V, f = 1 MHz Crss 110 Coss 250 Ciss 1650 gfs 10 pF S IGES 180 ICES 0.5 2 0.8 nA VCE(sat) 2.5 3.1 3 3.7 mA VGE(th) 4.5 5.5 6.5 V Values typ. max. Unit 2 Oct-20-1997 BSM 25 GD 120 DN2 Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Symbol min. Switching Characteristics, Inductive Load at Tj = 125 C Turn-on delay time VCC = 600 V, VGE = 15 V, IC = 25 A RGon = 47 Rise time VCC = 600 V, VGE = 15 V, IC = 25 A RGon = 47 Turn-off delay time VCC = 600 V, VGE = -15 V, IC = 25 A RGoff = 47 Fall time VCC = 600 V, VGE = -15 V, IC = 25 A RGoff = 47 Free-Wheel Diode Diode forward voltage IF = 25 A, VGE = 0 V, Tj = 25 C IF = 25 A, VGE = 0 V, Tj = 125 C Reverse recovery time IF = 25 A, VR = -600 V, VGE = 0 V diF/dt = -800 A/s, Tj = 125 C Reverse recovery charge IF = 25 A, VR = -600 V, VGE = 0 V diF/dt = -800 A/s Tj = 25 C Tj = 125 C 2.3 6 Qrr 0.13 C trr VF 2.3 1.8 2.8 s V 50 100 tf 400 600 td(off) 65 130 tr 75 150 td(on) ns Values typ. max. Unit 3 Oct-20-1997 BSM 25 GD 120 DN2 Power dissipation Ptot = (TC) parameter: Tj 150 C 220 W Ptot 180 160 140 120 100 Safe operating area IC = (VCE) parameter: D = 0, TC = 25C , Tj 150 C 10 2 t = 11.0s p A IC 10 1 100 s 1 ms 80 60 40 20 0 0 20 40 60 80 100 120 C 160 10 0 10 ms 10 -1 0 10 DC 10 1 10 2 10 3 V TC VCE Collector current IC = (TC) parameter: VGE 15 V , Tj 150 C 40 A Transient thermal impedance Zth JC = (tp) parameter: D = tp / T 10 0 IGBT K/W IC 32 28 24 20 16 10 12 8 4 0 0 20 40 60 80 100 120 C 160 10 -3 -5 10 10 -4 -2 ZthJC 10 -1 D = 0.50 0.20 0.10 0.05 0.02 single pulse 0.01 10 -3 10 -2 10 -1 s 10 0 TC tp 4 Oct-20-1997 BSM 25 GD 120 DN2 Typ. output characteristics IC = f (VCE) parameter: tp = 80 s, Tj = 25 C 50 A IC 40 35 30 25 20 15 10 5 0 0 1 2 3 V VCE 5 17V 15V 13V 11V 9V 7V Typ. output characteristics IC = f (VCE) parameter: tp = 80 s, Tj = 125 C 50 A IC 40 35 30 25 20 15 10 5 0 0 1 2 3 V VCE 5 17V 15V 13V 11V 9V 7V Typ. transfer characteristics IC = f (VGE) parameter: tp = 80 s, VCE = 20 V 50 A IC 40 35 30 25 20 15 10 5 0 0 2 4 6 8 10 V 14 VGE 5 Oct-20-1997 BSM 25 GD 120 DN2 Typ. gate charge VGE = (QGate) parameter: IC puls = 25 A 20 V Typ. capacitances C = f (VCE) parameter: VGE = 0 V, f = 1 MHz 10 1 nF VGE 16 14 12 10 Coss 8 10 -1 6 4 2 0 0 20 40 60 80 100 120 140 nC 170 10 -2 0 5 10 15 20 25 30 V VCE 40 Crss 600 V 800 V C Ciss 10 0 QGate Reverse biased safe operating area ICpuls = f(VCE) , Tj = 150C parameter: VGE = 15 V 2.5 Short circuit safe operating area ICsc = f(VCE) , Tj = 150C parameter: VGE = 15 V, tSC 10 s, L < 50 nH 12 ICpuls/IC ICsc/IC 8 1.5 6 1.0 4 0.5 2 0.0 0 200 400 600 800 1000 1200 V 1600 VCE 0 0 200 400 600 800 1000 1200 V 1600 VCE 6 Oct-20-1997 BSM 25 GD 120 DN2 Typ. switching time I = f (IC) , inductive load , Tj = 125C par.: VCE = 600 V, VGE = 15 V, RG = 47 10 3 Typ. switching time t = f (RG) , inductive load , Tj = 125C par.: VCE = 600 V, VGE = 15 V, IC = 25 A 10 3 tdoff t tdoff ns t ns tdon 10 2 tdon tr 10 2 tr tf tf 10 1 0 10 20 30 40 A IC 60 10 1 0 20 40 60 80 100 120 140 RG 180 Typ. switching losses E = f (IC) , inductive load , Tj = 125C par.: VCE = 600 V, VGE = 15 V, RG = 47 10 mWs E 8 7 6 5 4 3 2 1 0 0 10 20 30 40 A IC 60 Eoff Eon Typ. switching losses E = f (RG) , inductive load , Tj = 125C par.: VCE = 600V, VGE = 15 V, IC = 25 A 10 mWs E 8 7 6 5 4 3 2 1 0 0 20 40 60 80 100 120 140 Eoff Eon RG 180 7 Oct-20-1997 BSM 25 GD 120 DN2 Forward characteristics of fast recovery reverse diode IF = f(VF) parameter: Tj 50 A IF 40 35 30 Tj=125C 25 20 15 10 5 0 0.0 0.5 1.0 1.5 2.0 V VF 3.0 Tj=25C Transient thermal impedance Zth JC = (tp) parameter: D = tp / T 10 1 K/W ZthJC 10 0 Diode 10 -1 D = 0.50 0.20 0.10 0.05 0.02 single pulse 0.01 10 -2 10 -3 -5 10 10 -4 10 -3 10 -2 10 -1 s 10 0 tp 8 Oct-20-1997 BSM 25 GD 120 DN2 Circuit Diagram Package Outlines Dimensions in mm Weight: 180 g 9 Oct-20-1997 |
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